Thin Film Mechanics

Thin films are commonly encountered in microsystem technology and in microelectronic components. For the assessment of the reliability of thin film systems analysis and experimental methods for the assessment of failure modes are needed. We have investigated failure modes of thin film delamination and thin film wrinkling, as well as the interaction between these modes.

In the investigations of  thin film delaminations we have employed cohesive zone models and strain gradient plasticity models. For the analysis of wrinkling processes we have developed a spectral methods which allows us to include material heterogeneity and material non-linearity.
Thin Film
Collaborator: G. Subbarayan