Publications

Articles in refereed publications

  1. N. Trung, T. Siegmund, V. Tomar, J. Kruzic, “Interaction of rate- and size-effect using a dislocation density based strain gradient viscoplasticity model,” Journal of the Mechanics and Physics of Solids (2017) in press.
  2. Y. Zhang, P. Seiler, T. Siegmund, J. Kruzic, V. Tomar, “High temperature indentation based property measurements of Inconel IN-617,” International Journal of Plasticity 96 (2017) 264-281.
  3. W. Tsutsui, N. Parab, H. Liao, T. Nguyen, T. Siegmund, W. Chen, “State-of-charge and deformation-rate dependent mechanical behavior of electrochemical cells,” Experimental Mechanics, doi:10.1007/s11340-017-0282-2.
  4. S. Varanasi, T. Siegmund, J.S. Bolton, “Experiments on the low frequency barrier characteristics of cellular metamaterial panels in a diffuse sound field,” Journal of the Acoustical Society of America 141 (2017) 602-610.
  5. J. Kukreja, T. Nguyen, T. Siegmund, W. Chen, W. Tsutsui, K. Balakrishnan, H. Liao, N. Parab, “Crash analysis of a conceptual electric vehicle with a damage tolerant battery pack,” Extreme Mechanics Letters 9 (2016) 371-378.
  6. P. Seiler, J. Kruzic, V. Tomar, T. Siegmund, “Stationary and propagating cracks in a strain gradient visco-plastic solid," International Journal of Fracture 202 (2016) 111-125.
  7. Y. Chen, A. Ridruejo, C. Gonzalez, J. Llorca, T. Siegmund, “Notch effect in fracture of fiberglass non-woven materials,” International Journal of Solids and Structures 96 (2016) 254-264.
  8. T. N. Nguyen, T. Siegmund, W. Tsutsui, H. Liao, W. Chen “Bi-objective optimal design of a damage-tolerant multifunctional battery system,” Materials and Design 105 (2016) 51-65.
  9. T. Siegmund, F. Barthelat, R.J. Cipra, E. Habtour, J. Riddick, “Manufacture and mechanics of topologically interlocked material assemblies” ASME Applied Mechanics Reviews 68 (2016) 040803.
  10. W. Tsutsui, T. Nguyen, H. Liao, N. Parab, J. Kukreja, T. Siegmund, W. Chen, “Mechanical energy dissipation in a multifunctional battery system," MRS Advances 6 (2016) 381-388.
  11. P. Bhattacharya, J. Kelleher, T. Siegmund, “Role of gradients in vocal fold elastic modulus on phonation,” Journal of Biomechanics 48 (2015) 3356-3362.
  12. P. Bhattacharya, T. Siegmund, “The role of glottal surface adhesion in vocal fold biomechanics.”  Biomechanics and Modeling in Mechanobiology 14 (2015) 283-295.
  13. S. Khandelwal, R.J. Cipra, J.S. Bolton, T. Siegmund, “Adaptive mechanical properties of topologically interlocking material systems,” Smart Materials and Structures 24 (2015) 045037.
  14. Y. Feng, T. Siegmund, E. Habtour, J. Riddick, “Impact mechanics of topologically interlocked material assemblies," International Journal of Impact Engineering 75 (2015) 140-149.
  15. Kelleher, T. Siegmund, R.W. Chan, “Collagen microstructure in the vocal ligament: Initial results on the potential effects of smoking,” The Laryngoscope 124 (2014) E361-E367.
  16. P. Bhattacharya, T. Siegmund, "Computational modeling of vibration-induced systemic hydration of vocal folds over a range of phonation conditions," International Journal for Numerical Methods in Biomedical Engineering 30 (2014) 1019-1043.
  17. P. Bhattacharya, T. Siegmund, “Validation of a flow-structure-interaction computation model of phonation.” International Journal of Fluids and Structures 48 (2014) 169-187.
  18. S. Khandelwal, R.J. Cipra, J.S. Bolton, T. Siegmund, “Scaling of the elastic behavior of 2D topologically interlocked materials under transverse loading.” ASME Journal of Applied Mechanics 81 (2014) 031011.
  19. E. Hunter, T. Siegmund, R.W. Chan, “Strain modulations as a mechanism to reduce stress relaxation in laryngeal tissues,” PLoS Computational Biology 9 (2014) Article Number: e90762.
  20. Bhattacharya, T. Siegmund, “A computational study of systemic hydration in vocal fold collision," Computer Methods in Biomechanics and Biomedical Engineering 17 (2014) 1835-1852. 
  21. W. Gao, K. Ramani, T. Siegmund, R.J. Cipra, “Kinetogami: A reconfigurable combinatorial and printable sheet folding,” ASME Journal of Design 135 (2013) 111009.
  22. E. Hunter, A.K.R. Palaparthi, T. Siegmund, R.W. Chan, “Comparison of two laryngeal tissue fiber constitutive models,” Mechanics of Time-Dependent Materials 18 (2014) 179-196.
  23. Varanasi, J.S. Bolton, T. Siegmund, R.J. Cipra, “The low frequency performance of metamaterial barriers based on cellular structures,” Applied Acoustics 74 (2013) 485-495.
  24. J. Kelleher, T. Siegmund, M. Du, E. Naseri, R.W. Chan, “The anisotropic hyperelastic biomechanical response of the vocal fold ligament and implications for frequency regulation: a case study," Journal of the Acoustical Society of America 133 (2013) 1625-1636.
  25. J.E. Kelleher, T. Siegmund, M. Du, E., Naseri, R.W. Chan, “Empirical measurements of biomechanical anisotropy of the human vocal fold lamina propria,” Biomechanics and Modeling in Mechanobiology 12 (2013) 555-567.
  26. J.E. Kelleher, R.W. Chan, T. Siegmund, “Could spatial heterogeneity in human vocal fold elastic properties improve the quality of phonation?” Annals of Biomedical Engineering 40 (2012) 2708-2718.
  27. A. Paul, R.J. Cipra, T. Siegmund, “Robotic manufacturing of near-net-shape components utilizing stereo-imaging and reconfigurable tooling,” Journal of Advanced Manufacturing Technology 63 (2012) 999-1009.
  28. S. Brinckmann, T. Siegmund, “A model for the strength of nanopillars,” International Journal of Materials Research 103 (2012) 3-8.
  29. J. Han, T. Siegmund, “Cohesive zone model characterization of the adhesive Hysol E2324” Journal of Adhesion and Adhesives, 26 (2012) 1033-1052.
  30. K. Srinivasan, G. Subbarayan, T. Siegmund, “Analysis of wrinkling on irreversible foundations” Thin Solid Films 520 (2012) 5671-5682. 
  31. P. Bhattacharya, T. Siegmund, “A canonical biomechanical vocal fold model,” Journal of Voice 26 (2012) 535-547.
  32. Mather, R. Cipra, T. Siegmund, “Structural integrity during remanufacture of a topologically interlocked material,” International Journal of Structural Integrity 3 (2012) 61-78.
  33. S. Khandelwal, R.J. Cipra, J.S. Bolton, T. Siegmund, “Transverse loading of cellular topologically interlocked solids,” International Journal of Solids and Structures 49 (2012) 2394-2403.
  34. S. Goyal, K. Srinivasan, G. Subbarayan, T. Siegmund, “Estimating the yield strength of thin metal films through elastic-plastic buckling-induced debonding,” IEEE Transactions on Device and Materials Reliability 11 (2011) 358-361.
  35. J. Kelleher, R.W Chan, T. Siegmund, E. Henslee, “Optical measurements of vocal fold tensile properties: implications for phonatory mechanics,” Journal of Biomechanics 44 (2011) 1729-1734.
  36. S. Goyal, K. Srinivasan, G. Subbarayan, T. Siegmund, “Thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems,” Thin Solid Films, 518 (2010) 2056-2064.  
  37. S. Goyal, K. Srinivasan, G. Subbarayan, T. Siegmund, “On instability-induced debond initiation in thin film systems,” Engineering Fracture Mechanics 77 (2010) 1298-1313.
  38. T. Siegmund, M.R. Allen, D.B. Burr, “Can deterministic size effects contribute to fracture and microdamage accumulation in trabecular bone?” Journal of Theoretical Biology 265 (2010) 202-210.
  39. J. Kelleher, R.W Chan, T. Siegmund, “Spatially varying properties of the vocal ligament contribute
  40. to its eigenfrequency response,” Journal of the Mechanical Behavior of Biological Materials 3 (2010) 600-609.
  41. K. Zhang, T. Siegmund, R.W Chan, M. Fu, “Modeling of the transient stress-stretch responses of the vocal fold lamina propria under cyclic loading,” Journal of the Mechanical Behavior of Biomedical Materials 2 (2009) 93-104.
  42. K. Zhang, M. Fu, T. Siegmund, R.W. Chan, “Predictions of fundamental frequency changes during phonation based on a biomechanical model of the vocal fold propria,” Journal of Voice, 23 (2009) 277-282. 
  43. K. Srinivasan, S. Goyal, T. Siegmund, G. Subbarayan, Q. Lin, “Thermally induced wrinkling in thin-film stacks on patterned substrates,” IBM Journal of Research and Development 53 (2009) paper 12.
  44. S. Brinckmann, G. Gao, T. Siegmund, “A combined numerical-experimental study on the compaction behavior of NaCl,“ Powder Technology, 194 (2009) 197–206
  45. S. Kanuparthi, G. Subbarayan, T. Siegmund, B. Sammakia, "The effect of polydispersivity on the thermal conductivity of particulate thermal interface materials," IEEE CPMT - Institute of Electrical and Electronics Engineering Transactions on Components and Packaging Technologies, 32 (2009) 424-434.
  46. J. Han, T. Siegmund, “A computational model for delamination wear,” Wear, 267 (2009) 1680-1687.
  47. K. Zhang, R.W. Chan, T. Siegmund, “Biomechanics of fundamental frequency regulation: constitutive modeling of the vocal fold lamina propria,” Logopedics Phoniatrics Vocology, 6 (2009) 181-189.
  48. B. Wang, T. Siegmund, “A modified four-point bend delamination test,” Microelectronic Engineering, 85 (2008) 477-485.
  49. M. Spencer, L. Mongeau, T. Siegmund, “Experimental study of the self-oscillation of a model larynx by digital image correlation,” Journal of the Acoustical Society of America, 123 (2008) 1089-1103.
  50. S. Brinckmann, T. Siegmund, “On the influence of strain gradients on fatigue crack propagation predictions,” Engineering Fracture Mechanics, 75 (2008) 2276-2294.
  51. T. Siegmund, M. Allen, D. Burr, “Failure of mineralized collagen fibrils: modeling the role of collagen cross-linking,” Journal of Biomechanics, 41 (2008) 1427-1435.
  52. T. Siegmund, M. Allen, D. Burr, “Corrigenda: Failure of mineralized collagen fibrils: modeling the role of collagen cross-linking,” Journal of Biomechanics, 41 (2008) 1427-1435.” Journal of Biomechanics, 42 (2009) 404. 
  53. K. Srinivasan, Y. Huang, O. Kolednik, T. Siegmund, “The size dependence of micro-toughness in ductile fracture,” Journal of the Mechanics and Physics of Solids, 56 (2008) 2707-2726.
  54. S. Kanuparthi, G. Subbarayan, T. Siegmund, B. Sammakia, “An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials,” IEEE Transactions on Components and Packaging Technologies, 31 (2008) 611-621.
  55. S. Brinckmann, T. Siegmund, “A cohesive surface model based on the micromechanics of dislocations,“ Modeling and Simulation in Material Science and Engineering, 16 (2008) article number 065003.
  56. Selected as a 2008 Highlight paper for the journal
  57. K.A. Gunnerson, R. Cipra, T. Siegmund, “Near-net-shape manufacturing of short fiber composite parts via discrete depositions,” ASME Journal of Manufacturing Science and Engineering, 130 (2008) article number 061002.
  58. K. Zhang, T. Siegmund, R.W. Chan, “A two-layer model of the vocal fold lamina propria for fundamental frequency regulation,” Journal of the Acoustical Society of America, 122 (2007) 1090-1101.
  59. K. Srinivasan, O. Kolednik, T. Siegmund, “A micromechanics-based model for micro-toughness estimation from dimple geometry measurements,” Engineering Fracture Mechanics, 74 (2007) 1323-1343.
  60. J. Han, T. Siegmund, “A combined experimental-numerical study on crack growth in a carbon-carbon composite,” Fatigue and Fracture of Engineering Materials and Structures, 29 (2006) 632-645.
  61. B. Wang, T. Siegmund, “A computational analysis of size effects in fatigue crack growth,” Modeling and Simulation in Material Science and Engineering, 14 (2006) 775-787.
  62. S. Brinckmann, T. Siegmund, Y. Huang, “A dislocation mechanics based strain gradient plasticity model,” International Journal of Plasticity, 22 (2006) 1586-1609.
  63. M. Park, B.A. Cola, T. Siegmund, J. Xu, M.R. Maschmann, T.S. Fisher, H. Kim, “Effects of carbon nanotube layer on electrical contact resistance between copper substrates,” Nanotechnology, 17 (2006) 2294-2303.
  64. B. Wang, T. Siegmund, “Simulation of fatigue crack growth at plastically mismatched bi-material interfaces“, International Journal of Plasticity, 22 (2006) 1586-1609.
  65. A. Mather, R. Cipra, T. Siegmund, “An image analysis technique to assist in the determination of orientation distributions of the manufacture of carbon fiber composites,” Transactions of the North American Manufacturing Research Institution of the Society of Manufacturing Engineers, 34 (2006), 237-243.
  66. K. Zhang, R. Chan, T. Siegmund, “A constitutive model of the human vocal fold cover for fundamental frequency response”, Journal of the Acoustical Society of America, 119 (2006) 1050-1062.
  67. B. Wang, T. Siegmund, “Numerical simulation of constraint effects in fatigue crack growth,” International Journal of Fatigue, 27 (2005) 1328-1334.
  68. A. Hattiangadi, T. Siegmund, “An analysis of the delamination of an environmental protection coating under cyclic heat loads,” European Journal of Mechanics/ A Solids, 24 (2005) 361-370. 
  69. A. Hattiangadi, T. Siegmund, “A numerical study on interface crack growth under heat flux loading,” International Journal of Solids and Structures, 42 (2005) 6335-6355.
  70. B. Wang, T. Siegmund, “A numerical analysis of constraint effects in fatigue crack growth by use of an irreversible cohesive zone model,” International Journal of Fracture, 132 (2005) 175-196.
  71. S. Qu, T. Siegmund, Y. Huang, P.D Wu, F. Zhang, K.C. Huang, “A study of particle size effect and interface fracture in aluminum alloy composite via an extended conventional theory of mechanism-based strain gradient plasticity,” Journal of Composite Materials, 65 (2005) 1244-1253.
  72. T. Siegmund, “A numerical study of transient fatigue crack growth by use of an irreversible cohesive zone model,” International Journal of Fatigue, 26 (2004) 929-939.
  73. R.W. Chan, T. Siegmund, “Vocal fold tissue failure: preliminary data and constitutive modeling,” ASME Journal of Biomechanical Engineering, 126 (2004) 466-474.
  74. W. Li, T. Siegmund, “A numerical study of indentation delamination of weakly bonded ductile films on elastic substrates,” Acta Materialia, 52 (2004) 2989-2999.
  75. V. Singhal, T. Siegmund, S.V. Garimella, “Optimization of thermal interface materials for electronics cooling applications,” IEEE CPMT - Institute of Electrical and Electronics Engineering Transactions on Components and Packaging Technologies, 27 (2004) 244-252.
  76. J. Park, L. Mongeau, T. Siegmund, “An investigation of the flow-induced sound and vibration of viscoelastically supported rectangular plates: experiments and model verification,” Journal of Sound and Vibration, 275 (2004) 249-265.
  77. A. Hattiangadi, T. Siegmund, “A thermomechanical cohesive zone model for bridged delamination cracks,” Journal of the Mechanics and Physics of Solids, 52 (2004) 533-566.
  78. W. Li, T. Siegmund, “Numerical study of indentation delamination of strongly bonded films by use of a cohesive zone model,” Computer Modeling in Engineering and Sciences, 5 (2004) 81-90.
  79. J. Park, L. Mongeau, T. Siegmund, "Effects of geometric parameters on the sound transmission characteristics of bulb seals," SAE 2003 Transactions, Journal of Passenger Cars -Mechanical Systems, (2003) 2196-2203.
  80. J. Park, L. Mongeau, T. Siegmund, "Effects of window seal mechanical properties on vehicle interior noise," SAE 2003 Transactions, Journal of Passenger Cars -Mechanical Systems, (2003) 2204-2211.
  81. C.R. Chen, O. Kolednik, I. Scheider, T. Siegmund, A. Tatschl, F.D. Fischer, “On the determination of the cohesive zone parameters for the modeling of micro-ductile crack growth in thick specimens,” International Journal of Fracture, 120 (2003) 517-536.
  82. W. Li, T. Siegmund, “An analysis of a size effect in indentation delamination of a ductile film on an elastic substrate,” Scripta Materialia, 49 (2003) 497-502.
  83. J. Park, T. Siegmund, L. Mongeau, “Viscoelastic properties of foamed thermoplastic vulcanizates and their dependence on void fraction,” Cellular Polymers, 22 (2003) 137-156.
  84. J. Park, L. Mongeau, T. Siegmund, “Influence of support properties on the sound radiated from the vibrations of rectangular plates,” Journal of Sound and Vibration, 264 (2003) 775-794.
  85. J. Liakus, B. Wang, R. Cipra, T. Siegmund, “Processing-microstructure-property predictions for short fiber reinforced composite structures based on a spray deposition process,” Composite Structures, 61 (2003) 363-374.
  86. J. Park, T. Siegmund, L. Mongeau, “Analysis of the flow-induced vibrations of viscoelastically supported rectangular plates,” Journal of Sound and Vibration, 261 (2003) 225-245.
  87. C. Xu, T. Siegmund, K. Ramani, “Rate dependent crack growth in adhesives, I: Modeling approach,” International Journal of Adhesion and Adhesives, 23 (2003) 9-13.
  88. C. Xu, T. Siegmund, K. Ramani, “Rate dependent crack growth in adhesives, I: Experiments and analysis,” International Journal of Adhesion and Adhesives, 23 (2003) 15-22.
  89. K.L. Roe, T. Siegmund, “An irreversible cohesive zone model for interface fatigue crack growth simulations,” Engineering Fracture Mechanics, 70 (2003) 209-232.
  90. J. Park, T. Siegmund, L. Mongeau, “Sound transmission through elastomeric bulb seals,” Journal of Sound and Vibration, 259 (2003) 299-322.
  91. A. Hattiangadi, T. Siegmund, “Bridging effects in cracked laminates under thermal gradients,” Mechanics Research Communications, 29 (2002) 457-464.
  92. W. Li, T. Siegmund, “An analysis of crack growth in thin-sheet metal via a cohesive zone model,” Engineering Fracture Mechanics, 69 (2002) 2073-2093.
  93. T. Siegmund, R. Cipra, J. Liakus, W. Strieder, F.R Jacobs, A. Fatz, T. Cordell, C. Parker, F. Dillon, M. La Forest, “A novel approach to manufacturing low cost high temperature composite materials,” Transactions of the North American Manufacturing Research Institution of the Society of Manufacturing Engineers, 20 (2002) 557-564.
  94. T. Siegmund, W. Brocks, “A numerical study on the correlation between the work of separation and the dissipation rate in ductile fracture,” Engineering Fracture Mechanics, 67 (2000) 139-154.
  95. K. Keller, S. Weihe, T. Siegmund, B. Kröplin, “Generalized cohesive zone model: incorporating triaxiality dependent failure mechanisms,” Computational Materials Science, 16 (1999) 267-274.
  96. Steglich, T. Siegmund, W. Brocks, “Micromechanical modeling of damage due to particle cracking in reinforced metals,” Computational Materials Science, 16 (1999) 404-413.
  97. T. Siegmund, W. Brocks, “Prediction of the work of separation and implications to the modeling,” International Journal of Fracture, 99 (1999) 97-116.
  98. T. Siegmund, W. Brocks, “Local fracture criteria: lengthscales and applications,” Journal de Physique IV France, 8 (1998) 349-356.
  99. T. Siegmund, W. Brocks, “Tensile decohesion by local failure criteria,” Technische Mechanik, 4 (1998) 261-270.
  100. T. Siegmund, N.A. Fleck, A. Needleman, “Dynamic crack growth across an interface,” International Journal Fracture, 85 (1997) 381-402.
  101. T. Siegmund, A. Needleman, “A numerical study of dynamic crack growth in elastic-viscoplastic solids,” International Journal of Solids and Structures, 34 (1997) 769-787. 
  102. T. Siegmund, E. Werner, F.D. Fischer, “On the thermomechanical deformation behavior of duplex-type materials,” Journal of the Mechanics and Physics of Solids, 43 (1995) 495-532. 
  103. A. Parteder, T. Siegmund, F.D. Fischer, S. Schlögl, “Numerical simulation of the plastic behavior of polysynthetically twinned Ti-Al crystals,” Materials Science and Engineering, A192/193 (1995) 149-154.
  104. E. Werner, T. Siegmund, H. Weinhandl, F.D. Fischer, “Properties of random polycrystalline two-phase materials,” Applied Mechanics Reviews, 47 (1994) S231-S240.
  105. H.J. Böhm, F.D. Fischer, F.G. Rammerstorfer, T. Siegmund, “Microscale arrangement effects on the thermomechanical behavior of advanced two-phase materials,” Transactions of the American Society of Mechanical Engineers, Journal of Engineering Materials and Technology, 116 (1994) 268-273.
  106. E. Werner, T. Siegmund, H. Weinhandl, “Topological characteristics of two-phase microstructures,” Practical Metallography, 26 (1994) 237-245.
  107. E. Werner, T. Siegmund, F.D. Fischer, “A computer study of the thermomechanical deformation behavior of a duplex steel,” Computational Material Science, 3 (1994) 279-285.
  108. T. Siegmund, E. Werner, F.D. Fischer, “Structure-property relations in duplex materials,” Computational Material Science,” 1 (1993) 234-240.
  109. T. Siegmund, E. Werner, F.D. Fischer, “The irreversible deformation of a duplex steel under thermal cycling,” Material Science and Engineering, A169 (1993) 125-134.
  110. T. Siegmund, O. Kolednik, R. Pippan, “Direct measurement of the cyclic crack-tip deformation,” Zeitschrift fuer Metallkunde, 81 (1990) 677-683. 

 

Patents

  1. “Impact resistant battery enclosure systems,” Publication No. US 20150155534, Date of Patent filing: June 4, 2015, W. Tsutsui, Y. Feng, W. Chen, T. Siegmund. Patent allowed as of 9/19/2017.
  2. “Sound barrier systems,” US Patent 9,163,398. Date of Patent: October 20, 2015. S. Varanasi, S. Khandelwal, J.S. Bolton, T. Siegmund, R.C. Cipra.
  3. “Brake assembly having multi-piece core and replaceable friction surfaces,” US Patent 20090139807. Date of Patent: June 4, 2009. S.T. Fryska, A. Mather, R.J. Cipra, T. Siegmund, A.H. Simpson, M. LaForest.
  4. “Molding process and tools therefor,” US Patent 7,997,891. Date of Patent: August 16, 2011. J. Gallagher, R.J. Cipra, T. Siegmund.
  5. “Manufacture of thick preform composites via multiple pre-shaped fabric mat layers,” US Patent 7,197,739, Date of Patent: April 3, 2007. Inventors: M. LaForest, N.A. Gharbieh, R.J. Cipra, A. Fatz, T. Siegmund.
  6. “Binderless preform manufacture,” US Patent 20050093188, Date of patent: May 5, 2005; Inventors: M. LaForest, N.A. Gharbieh, S. Fryska, A. Simpson, B.P Soos, A. Fatz, R.J. Cipra, T. Siegmund. 
  7. “Manufacturing of functionally graded carbon-carbon composite,” US Patent 7063870, Date of Patent: June 20, 2006. M. La Forest, C.A. Parker, F. Dillon, T. Siegmund, R.J. Cipra, A.E. Fatz, P.F. Braunisch, T. Cordell.

 

Refereed conference or symposium proceedings

  1. S. Varanasi, J.S. Bolton, T. Siegmund, “Random incidence transmission loss,” Proceedings 2014 inter.noise Conference, Nov. 16-19, 2014, Melbourne, Australia, Paper No. 860.
  2. T. Siegmund, S. Khandelwal, B. Wheatley, S. Varanasi, R. Cipra, J.S. Bolton, “Multifunctional composites by segmentation and assembly,” Proceedings of the 19th International Conference on Composite Materials, Montreal, July 18-August 2, 2013, p.23 -31.
  3. S. Varanasi, J.S. Bolton, T. Siegmund, R.J. Cipra, “The low frequency performance of metamaterial barriers based on cellular structures,” Proceedings 2011 inter.noise Conference, Sep. 4-7, 2011, Osaka, Japan.
  4. S. Goyal, K. Srinivasan, G. Subbarayan, T. Siegmund, “Buckling, wrinkling and debonding in thin film systems,” Proceedings 2010 IEEE International Reliability Physics Symposium, May 2-6, 2010 Anaheim, California, p. 430-439.
  5. A. Paul, J. Gallagher, R. Cipra, T. Siegmund, “Robotic manufacturing of near-net shaped short-fiber reinforced composites with functional properties” Proceedings of the 2009 ASME International Manufacturing Science and Engineering Conference MSEC2009, October 4-7, 2009, West Lafayette, IN, USA, Paper No. MSEC2009-84158.
  6. S. Kanuparthi, G. Subbarayan, T. Siegmund, B. Sammakia, “Microstructural characteristics influencing the effective thermal conductivity of particulate thermal interface materials,” Proceedings of ITherm 2008 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Conference, Paper No. 2356, p. 227-237. (paper received an ITherm Best Paper Award)
  7. S. Goyal, K. Srinivasan, G. Subbarayan, T. Siegmund, “A novel, non-contact thermally driven buckling delamination test to determine the interface adhesion of thin films,” Proceedings of the Semiconductor Research Corporation Technology Conference (TECHCON), Austin, Texas, Sep 10-12, 2007, Paper No: P019898.
  8. K. Srinivasan, S. Goyal, G. Subbarayan, T. Siegmund, "Thermally-induced wrinkling in metal-capped polymer thin films on patterned substrates," Proceedings of the Semiconductor Research Corporation Technology Conference (TECHCON), Austin, Texas, Sep 10-12, 2007, Paper No: P019903.
  9. T. Siegmund, S. Khandelwal, S. Frankel, “On the mechanics of phonation and fluid-structure interactions in a three dimensional vocal fold model,” Proceedings of the 2007 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, Seattle, WA, (2007), Vol. 10, Parts A and B, p. 775-780, Paper No: IMECE2007-42185.
  10. M. Spencer, L. Mongeau, T. Siegmund, “A study of self-oscillation of a model vocal fold system by digital image correlation,” Proceedings of the 2006 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, Chicago, IL, (2006) Paper No: IMECE2006-13767.
  11. S. Brinckmann, T. Siegmund, “Experimental and numerical study on environmental degradation of adhesively bonded composite structures,” 21st Annual Technical Conference of the American Society for Composites, Dearborn, MI, September 17-20, (2006) Paper No: 197.
  12. S. Kanuparthi, X. Zhang, G. Subbarayan, B.G. Sammakia, T. Siegmund, A. Gowda, S. Tonapi, “Random network percolation models for particulate thermal interface materials,” Proceedings of ITherm 2006 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Conference, San Diego, May 30 – Jun 2, 2006, Vols. 1 and 2, p. 1192-1198.
  13. S. Brinckmann, T. Siegmund, “Fatigue crack growth simulations with length scale dependent material laws,” Proceedings of the 2006 International Fatigue Congress, Johnson S., Newman J., Jr, Saxena, A., eds, Atlanta, GA, May, 2006.
  14. K. Srinivasan, O. Kolednik, T. Siegmund, “A microtoughness model for ductile fracture incorporating size effects,” Proceedings of the 16th European Conference on Fracture, E. D. Goutos, ed., Alexandroupolis, Greece, July, 2006.
  15. S. Mantha, L. Mongeau, T. Siegmund, “Dynamic digital image correlation of a dynamic physical model of the vocal folds,” Advances in Bioengineering 57, pp 77-78. Proceedings of the 2005 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, Orlando, FL, (2005) Paper No: IMECE2005-81457.
  16. S. Mantha, L. Mongeau, T. Siegmund, “Dynamic digital image correlation of a dynamic physical model of the vocal folds,” Proceedings of the 4th International Workshop on Models and Analysis of Vocal Emissions for Biomedical Applications, Florence, Italy, October 29-31, 2005.
  17. A. Hattiangadi, T. Siegmund, “A coupled thermomechanical cohesive zone model for interface crack growth in thermal protection systems,” Proceedings of the 11th International Congress on Fracture (ICF 11), Turin, Italy, A. Carpinteri Ed. (2005), Paper No: 3972. 
  18. B. Wang, T. Siegmund “Numerical simulations of constraint and size effects in fatigue crack growth,” Proceedings of the 11th International Congress on Fracture (ICF 11), Turin, Italy, A. Carpinteri Ed., (2005), Paper No: 3975. 
  19. R.W. Chan, T. Siegmund, K. Zhang, N. Tirunagari, M. Fu, “Structural constitutive characterization of the vocal fold: modeling the fibrous and interstitial matrix proteins,” Proceedings of the 2004 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, Los Angeles, CA, CD-proceedings, (2004) Paper No: IMECE2004-61298.
  20. B. Wang, T. Siegmund, ”Simulation of fatigue crack growth at bi-material interfaces,” Proceedings of the 2004 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, Los Angeles, CA, CD-proceedings, (2004) Paper No: IMECE2004-60956.
  21. W. Li, T. Siegmund, S. Qu, Y. Huang, ”A study on lengthscale effects on indentation delamination of thin films,” Proceedings of the 2004 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, Washington D.C., CD-proceedings, (2004) Paper No: IMECE2004-61160.
  22. K. Srinivansan, O. Kolednik, T. Siegmund, “A study on crack propagation in heterogeneous elastic-plastic solids,” Proceedings of the 15th European Conference on Fracture, F. Nielson ed., Stockholm, July, 2004.
  23. T. Siegmund, A. Hattiangadi, “A study of delaminations in high temperature laminates under thermal gradient loading,” Proceedings of the 2003 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, Washington D.C., CD-proceedings, (2003) Paper No: IMECE2003-43231.
  24. T. Siegmund, R. Cipra, B. Wang, L. Liakus, “Processing-microstructure-strength predictions for short fiber reinforced composite structures,” Proceedings of the 2003 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, Washington D.C., CD-proceedings, (2003) Paper No: IMECE2003-43287.
  25. T. Siegmund, A. Hattiangadi, “A coupled thermomechanical formulation for analysis of interface delaminations under thermal transient loading,” Proceedings of the 2003 International Congress on Thermal Stresses, L. Librescu, P. Marzocca, eds, Virginia Institute of Technology, (2003), Paper No: TA-6-2-1 – TA-6-2-3.
  26. J. Park, L. Mongeau, and T. Siegmund, “Effects of geometric parameters on the sound transmission characteristics of bulb seals,” Proceedings of the 2003 SAE Noise & Vibration Conference, The Society of Automotive Engineering, Traverse City, Michigan, CD-proceedings, (2003) Paper No: 2003-01-1701.
  27. J. Park, L. Mongeau, T. Siegmund, “Effects of window seal mechanical properties on vehicle interior noise,” Proceedings of the 2003 SAE Noise & Vibration Conference, Traverse City, Michigan, CD-proceedings, (2003) Paper No: 2003-01-1703.
  28. A. Hattiangadi, T. Siegmund, “Quantitative photothermal NDE of composites – Numerical analysis,” Proceedings of the 2002 International Mechanical Engineering Congress and Exposition, The American Society of Mechanical Engineers, New Orleans, LA, CD-proceedings, (2002) Paper No: IMECE2002-33865.
  29. T. Siegmund, “Material failure modeling by cohesive zone models,” Proceedings of the 5th World Congress on Computational Mechanics (WCCM V), Vienna, Austria, H.A. Mang, F.G. Rammerstorfer, J. Eberhardsteiner, eds, Publisher: Vienna University of Technology, Austria, ISBN 3-9501554-0-6, http://wccm.tuwien.ac.at (2002)
  30. K. Roe, T. Siegmund, “A numerical study of transient fatigue crack growth by use of a cohesive zone model,” Proceedings of the 8th International Fatigue Congress, Stockholm, Sweden, A.F. Blom, ed., EMAS Publisher, (2002) 99-106.
  31. T. Siegmund, “Advanced cohesive zone models for fracture simulation,” Proceedings of the 10th International Congress of Fracture (ICF 10), Honolulu, Hawaii, K. Ravi-Chandar, T. Kishi, R.O. Ritchie, A.T. Yokobori Jr, T. Yokobori, eds, CD-proceedings, (2002) Paper No: 1009090R.
  32. C.R. Chen, I. Scheider, T. Siegmund, A. Tatschl, O. Kolednik, F.D. Fischer, “Fracture initiation and crack growth - cohesive zone modeling and stereoscopic measurements,” Proceedings of the 10th International Congress of Fracture (ICF 10), Honolulu, Hawaii, K. Ravi-Chandar, T. Kishi, R.O. Ritchie, A.T. Yokobori Jr, T. Yokobori, eds., CD-proceedings, (2002) Paper No: 100409PR.
  33. A. Fatz, T. Cordell, F. Dillon, M. LaForest, P. Braunisch, T. Siegmund, R. Cipra, J. Liakus, W. Strieder, S. Upadhyayula, S. Saddawi, “Manufacture of functionally gradient carbon-carbon composites,” Proceedings of the 17th Technical Conference of the American Society of Composites, Purdue University, West Lafayette, CT Sun, H. Kim, eds, CD-proceedings, CRC Press, (2002) Paper No: 2022.
  34. J. Han, T. Siegmund, “A combined experimental-numerical investigation of crack growth in C-C composites,” Proceedings of the 17th Technical Conference of the American Society of Composites, Purdue University, West Lafayette, CT Sun, H. Kim, eds, CD-proceedings, CRC Press, (2002) Paper No: 2023. (paper received the 2002 Best Paper Award).
  35. A. Hattiangadi, T. Siegmund, “A thermomechanical crack bridging model,” Proceedings of the 17th Technical Conference of the American Society of Composites, Purdue University, West Lafayette, CT Sun, H. Kim, eds, CD-proceedings, CRC Press, (2002) Paper No: 2025.
  36. V. Singhal, S. V. Garimella and T. Siegmund, “Determination of optimal filler volume fraction for thermal interface materials in electronics cooling applications,” Heat Transfer 2002, Proceedings of the International Heat Transfer Conference, Grenoble, France, 3 (2002) 9-14.
  37. T. Siegmund, W. Brocks, “The role of cohesive strength and separation energy for modeling of ductile fracture,” Fatigue and Fracture Mechanics: 30th Volume. K.L. Jerina, P.C. Paris, eds, American Society for Testing and Materials. Special Technical Publication 1360, (2000) 139-151.
  38. K. Roe, T. Siegmund, “Simulation of interface fatigue crack growth via a fracture process zone model,” Proceedings of the 1st M.I.T. Conference on Computational Fluids and Solid Mechanics, Boston, MA, K.J. Bathe, ed., Elsevier, (2001) 435-437.
  39. J. Park, T. Siegmund, L. Mongeau, “Sound radiation from a flow-excited rectangular plate with viscoelastic supports,” Proceedings of the 2001 International Mechanical Engineering Congress and Exposition, New York, NY, American Society of Mechanical Engineers, CD proceedings, (2001) Paper No: IMECE2001/NCA-23508.
  40. J. Park, T. Siegmund, L. Mongeau "Sound transmission through elastomeric sealing systems" Proceedings of the 2001 SAE Noise & Vibration Conference, The Society of Automotive Engineering, Traverse City, MI, CD proceedings, (2001) Paper No: 2001-01-1411.
  41. W. Brocks, T. Siegmund, J. Heerens, “Effects of geometry and materials on the energy dissipation rate,” Proceedings of the 13th European Conference of Fracture (ECF 13), San Sebastian, Spain, CD proceedings, (2000) Paper No: 008 043701 X.
  42. T. Siegmund, “Buckling vs. crack growth: numerical simulation,” Proceedings of the 2000 International Mechanical Engineering Congress and Exposition, Orlando, FL, Symposium on “Recent Advances in Solids and Structures”, Y.W. Kwon, ed., American Society of Mechanical Engineers, PVP-Vol. 415 (2000) 12-18.
  43. T. Siegmund, W. Brocks, “Modeling crack growth in thin sheet aluminum alloys,” Fatigue and Fracture Mechanics: 31st Volume. G.R. Halford, J.P. Gallagher, eds, American Society for Testing and Materials Special Technical Publication 1389, (2000) 475-485.
  44. T. Siegmund, “Interface design and thermal stresses in layered microelectronic assemblies,” Proceedings of the 2000 International Symposium on Advanced Packaging, Materials: Processes, Properties and Interfaces, International Microelectronics and Packaging Society, Braselton, Georgia, (2000) 249-253.
  45. T. Siegmund, W. Brocks, G. Tempus, W. Zink, “Modeling of crack growth in thin sheet aluminium,” Proceedings of the 2000 International Mechanical Engineering Congress and Exposition, Nashville, TN, Symposium on “Recent Advances in Solids and Structures”, Y.W. Kwon, H.C. Chung, eds, American Society of Mechanical Engineers, PVP-Vol. 398 (1999) 15-22.
  46. W. Brocks, T. Siegmund, “Cohesive strength and separation energy in ductile crack growth,” Proceedings of the 7th International Symposium on Plasticity and its Current Applications, A. Khan, ed., (1999) 545-548.
  47. T. Siegmund, W. Brocks, J. Heerens, G. Tempus, W. Zink, “Modeling of crack growth in thin aluminium sheets,” Proceedings of the 31st Meeting of the Working Group on Fracture, W. Brocks, ed., The German Society of Materials Testing (DVM), (1999) 33-40.
  48. T. Siegmund, W. Brocks, “Length scales in modeling ductile fracture by cohesive elements,” Proceedings of the 19th Riso International Symposium on Materials Science, J.V. Carstensen et al., eds, Riso National Laboratory, Denmark, (1998) 485-490.
  49. T. Siegmund, G. Bernauer, W. Brocks, “Two models of ductile fracture in contest: Porous metal plasticity and cohesive elements,” Proceedings of the 12th European Conference of Fracture (ECF 12), Sheffield, UK, M.W. Brown, et al., eds, EMAS Publishing Group, (1998) 933-938.
  50. T. Siegmund, W. Brocks, “Local fracture criteria: lengthscales and applications,” Proceedings of the 2nd Euromech-Mecamat Conference, Magdeburg, Germany, (1998) 347-354.
  51. T. Siegmund, A. Needleman, “Numerical studies of fast crack growth in elastic-plastic solids,” Proceedings of the IUTAM Symposium “Nonlinear Fracture”, The International Union on Technical and Applied Mechanics, J.R. Willis, ed., Kluwer, (1997) 217-228.
  52. T. Siegmund, F.D. Fischer, E. Werner, “Microstructure characterization and FE-modeling of plastic flow in a duplex-steel,” Proceedings of the IUTAM Symposium “Microstructure-Property Interactions in Composite Materials,” The International Union on Technical and Applied Mechanics, R. Pryrz, ed., Kluwer, (1995) 349-360.
  53. T. Siegmund, G. Hochörtler, “Thermomechanical behavior of duplex steels with special reference to heavy forging parts,” Proceedings of the Symposium “Future Oriented Material Developments,” H. Kreulitsch, A. Schmidt, eds, Leoben, Austria, (1993) 172-186.
  54. T. Siegmund, F.D. Fischer, “On the plastic flow properties of two-phase alloys with coarse microstructure,” First Forum of Young European Researchers “From Microscopic to Macroscopic in Mechanics of Materials,” Liege, Belgium (1993) 55-60.
  55. T. Siegmund, F.D. Fischer, K.L. Maurer, “Duplex steel under thermal cycling – experiments and a micromechanical model,” Proceedings of the 3rd International Conference on Low Cycle Fatigue and Elasto-Plastic Behavior of Materials (LCF 3), K.-T. Rie, ed., Elsevier, Essex, (1992) 186-191.
  56. H.J. Böhm, F.D. Fischer, F.G. Rammerstorfer, T. Siegmund, “Plasticity effects in thermal cycling of multiphase materials,” Proceedings of the 3rd Conference on Computational Plasticity, Fundamentals and Applications (COMPLAS 3), D.R. Owen, E. Onate, E. Hinton, eds, Pineridge Press (1992) 1719-1731.
  57. T. Siegmund, E. Weissenbek, F.D. Fischer, F.G. Rammerstorfer, “Micromechanical consideration of topological aspects regarding thermocyclic behaviour;” Proceedings of the International Conference on Processing and Properties of Materials, M.H. Loretto, C.J. Beevers, eds, Materials and Component Engineering Publications, (1992) 971-976.
  58. T. Siegmund, E. Werner, F.D. Fischer, “Duplex steel specimen under thermal cycling,” Proceedings of the International Conference on Duplex Stainless Steels, J. Charles, S. Berhardson, eds, les editions de physique, Les Ulis, France, (1991) 479-486.